B8-10

CASE E

CASE E

BOTTOM VIEW

See Figures 16 – 18

for pin configurations.

Squared corner and dot on top

of case indicate pin one.

1.460 max

(37.08)

1.130 max

(28.70)

Materials

Header Cold Rolled Steel/Nickel/Gold

Cover

Kovar/Nickel

(SMHF Series

Cold Rolled Steel/Nickel/Gold)

Pins

#52 alloy/Gold

compression glass seal

Case dimensions in inches (mm)

Tolerance

±0.005 (0.13) for three decimal places

±0.01 (0.3) for two decimal places

unless otherwise specified

CAUTION

Heat from reflow or wave soldering may damage

the device. Solder pins individually with heat

application not exceeding 300

°C for 10 seconds

per pin.

0.000

0.160

(4.06)

0.960

(24.38)

1

2345

0.030 dia.

(0.76)

87

6

MHF+ Series Single and Dual: Screening – Standard, ES, or 883

MHF Series and LIM5050 Module: Screening – Standard or ES

SMHF Series Single and Dual and SLIM5050 Module:

Screening – Space Standard, H, or K

HR120 Series: No screening options

BOTTOM VIEW CASE E1

Projection Weld

Seam Seal

Squared corner and dot on top

of case indicate pin one.

Note: Although every effort has been made to render the case drawings at actual size, variations in the printing process may cause some distortion. Please refer

to the numerical dimensions for accuracy.