3.4

Device structure

The LPS33K has a unique cylindrical package solution with a full metal lid assembled on ceramic substrate and

this cylindrical package provides an easy assembly with O-rings in the end user’s application.

This structure (Figure 4) is to show the inner structure of the LPS33K with a metal lid and potting gel. This

structure is designed for and proven to protect electronic components from long-term exposure to harsh

environments such as water mixed with chlorine, bromine, commercial washing detergent and fuels, solvents and

chemicals. It also provides excellent low-stress encapsulation performance for sensitive electronic components

from severe environmental conditions such as high temperature and humidity, refer to the properties of the gel

which are given in the following table.

Properties

Potting gel

Permeability g/m²·24 hr

7

Hardness (penetration) based on ASTM D1403

70

Ultra-low Young's modulus

Less than 0.01 GPa

TCE (Thermal Coefficient of Expansion)

300 ppm/°C

LPS33K

Device structure

DS12817 - Rev 3

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