HLMP-EG10-R2000 datasheet(14/18 Pages) BOARDCOM

14 / 18 page

HLMP-ELxx, HLMP-EHxx, HLMP-EJxx, HLMP-EGxx Data Sheet

T-1¾ (5 mm) Precision Optical Performance AlInGaP LED Lamps

Broadcom

AV02-0373EN



If the PCB board contains both through hole (TH) LED

and other surface-mount components, solder the

surface-mount components on the top side of the PCB.

If the surface mount must be on the bottom side, solder

these components using reflow soldering prior to the

insertion of the TH LED.



The following table shows the recommended PC board

plated through holes (PTH) size for LED component

leads.



Over-sizing the PTH can lead to a twisted LED after

clinching. On the other hand, under-sizing the PTH can

cause difficulty when inserting the TH LED.

NOTE: Refer to application note AN-5334 for more

information about soldering and handling

high-brightness TH LED lamps.

Application Precautions



The drive current of the LED must not exceed the

maximum allowable limit across temperature as stated

in the data sheet. Constant current driving is

recommended to ensure consistent performance.



LEDs exhibit slightly different characteristics at different

drive currents that might result in larger performance

variations (such as intensity, wavelength, and forward

voltage). Set the application current as close as

possible to the test current to minimize these variations.



The LED is not intended for reverse bias. Use other

appropriate components for such purposes. When

driving the LED in matrix form, ensure that the reverse

bias voltage does not exceed the allowable limit of the

LED.

Figure 12: Example of Wave Soldering Temperature Profile for TH LED

LED Component

Lead Size

Diagonal

Plated Through Hole

Diameter

0.45 mm × 0.45 mm

(0.018 in. × 0.018 in.)

0.636 mm

(0.025 in.)

0.98 mm to 1.08 mm

(0.039 in. to 0.043 in.)

0.50 mm × 0.50 mm

(0.020 in. × 0.020 in.)

0.707 mm

(0.028 in.)

1.05 mm to 1.15 mm

(0.041 in. to 0.045 in.)

100

250

200

150

100

TIME (SECONDS)

PREHEAT

TURBULENT WAVE

LAMINAR WAVE

HOT AIR KNIFE

Recommended solder:

Sn63 (Leaded solder alloy)

SAC305 (Lead free solder alloy)

Flux: Rosin flux

Solder bath temperature:

245°C± 5°C (maximum peak

temperature = 250°C)

Dwell time: 1.5 sec - 3.0 sec

(maximum = 3sec)

Note: Allow for board to be sufficiently

cooled to room temperature before

exerting mechanical force.

HLMP-EG10-R2000 Folha de dados(PDF) 14 Page - Broadcom Corporation.

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