AM2434...ALV datasheet(129/280 Pages) TI

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7.9 Thermal Resistance Characteristics

For operation and reliability concerns, the maximum junction temperature of the device must be equal to or less

than the TJ value identified in Recommended Operating Conditions.

7.9.1 Thermal Resistance Characteristics

Table 7-2. Thermal Resistance Characteristics

TI recommends performing system level thermal simulations with worst case device power consumption.

NO.

PARAMETER(1)

DESCRIPTION

°C/W(2)

AIR FLOW

(m/s)(3)

ALV Package

RΘJC

Junction-to-case

0.98

N/A

RΘJB

Junction-to-board

3.87

N/A

RΘJA

Junction-to-free air

12.8

RΘJA

Junction-to-moving air

9.2

8.2

7.6

ΨJT

Junction-to-package top

0.53

0.55

0.57

T10

0.58

T11

ΨJB

Junction-to-board

3.74

T12

3.5

T13

3.4

T14

3.3

ALX Package

RΘJC

Junction-to-case

4.8

N/A

RΘJB

Junction-to-board

5.4

N/A

RΘJA

Junction-to-free air

19.8

RΘJA

Junction-to-moving air

14.1

12.3

ΨJT

Junction-to-package top

0.06

0.16

0.21

T10

0.25

T11

ΨJB

Junction-to-board

5.3

T12

4.95

T13

4.88

T14

4.83

(1)

These values are based on a JEDEC defined 2S2P system (with the exception of the Theta JC [RΘJC] value, which is based on a

JEDEC defined 1S0P system) and is subject to change based on environment as well as application. For more information, see the

EIA/JEDEC standards.

•

JESD51-2, Integrated Circuits Thermal Test Method Environment Conditions - Natural Convection (Still Air)

•

JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages

•

JESD51-6, Integrated Circuit Thermal Test Method Environmental Conditions - Forced Convection (Moving Air)

•

JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages

•

JESD51-9, Test Boards for Area Array Surface Mount Packages

(2)

°C/W = degrees Celsius per watt.

(3)

m/s = meters per second.

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AM2434, AM2432, AM2431

SPRSP65D – APRIL 2021 – REVISED AUGUST 2022

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