AiT Semiconductor Inc.

www.ait-ic.com

Lo Rho F1206L

SMD PPTC RESETTABLE FUSE

REV1.0 - AUG 2017 RELEASED -

- 3 -

Pad Layouts、Solder Reflow and Rework Recommendations

The dimension in the table below provide the recommended pad layout for each F1206L device

Pad dimensions (millimeters)

Device

A

Nominal

B

Nominal

C

Nominal

F1206L

2.00

1.00

1.90

Profile Feature

Pb-Free Assembly

Average Ramp-Up Rate (Tsmax to Tp) 3℃/second max.

Preheat:

Temperature Min (Tsmin)

Temperature Max Tsmax)

150℃

200℃

60~180 seconds

Time maintained above:

217℃

60~150 seconds

Peak/Classification Temperature(Tp): 260℃

Time within 5℃ of actual Peak:

Temperature (tp)

20~40 seconds

Ramp-Down Rate:

6℃/second max.

Time 25℃ to Peak Temperature:

8 minutes max.

Note 1: All temperatures refer to of the package,

measured on the package body surface.

Solder reflow

※ Due to “Lead Free” nature, Temperature and

Dwelling time for the soldering zone is higher

than those for Regular. This may cause

damage to other components.

1. Recommended max past thickness > 0.25mm.

2. Devices can be cleaned using standard

methods and aqueous solvent.

3. Rework use standard industry practices.

4. Storage Environment: < 30℃ / 60%RH

Caution:

1. If

reflow

temperatures

exceed

the

recommended profile, devices may not meet

the performance requirements.

2. Devices are not designed to be wave

soldered to the bottom side of the board.

Reflow Profile

NOTE: Specification subject to change without notice.