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USB5906C/KD Folha de dados(PDF) 59 Page - Microchip Technology

Nome de Peças USB5906C/KD
Descrição Electrónicos  6-Port USB 3.2 Gen 1 SmartHubTM IC with Support for a Single USB Type-C짰 UFP
PDF  64 Pages
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Fabricante Electrônico  MICROCHIP [Microchip Technology]
Página de início  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

USB5906C/KD Folha de dados(HTML) 59 Page - Microchip Technology

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2022 Microchip Technology Inc. and its subsidiaries
DS00003188C-page 59
USB5906C
FIGURE 11-3:
100-VQFN PACKAGE (LAND PATTERN)
RECOMMENDED LAND PATTERN
Dimension Limits
Units
C2
Center Pad Width
Contact Pad Spacing
Center Pad Length
Contact Pitch
Y2
X2
8.10
8.10
MILLIMETERS
0.40 BSC
MIN
E
MAX
11.70
Contact Pad Length (X100)
Contact Pad Width (X100)
Y1
X1
1.05
0.20
NOM
C1
Contact Pad Spacing
11.70
Contact Pad to Contact Pad (X96)
G2
0.20
Thermal Via Diameter
V
Thermal Via Pitch
EV
0.33
1.20
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Notes:
Dimensioning and tolerancing per ASME Y14.5M
For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during
reflow process
1.
2.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
Contact Pad to Center Pad (X100)
G1
1.28
Microchip Technology Drawing C04-2407-KD Rev C
SILK SCREEN
C1
EV
C2
EV
Y2
X2
ØV Ø0.33
E
X1
Y1
G1
G2



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