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AZC199-04S Folha de dados(PDF) 4 Page - AMAZING Microelectronic Corp.

Nome de Peças AZC199-04S
Descrição Electrónicos  Low Capacitance High ESD Level Protection Array For High Speed I/O Port
PDF  11 Pages
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Fabricante Electrônico  AMAZING [AMAZING Microelectronic Corp.]
Página de início  https://www.amazingic.com/en
Logo AMAZING - AMAZING Microelectronic Corp.

AZC199-04S Folha de dados(HTML) 4 Page - AMAZING Microelectronic Corp.

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AZC199-04S
Low Capacitance High ESD Level Protection Array
For High Speed I/O Port
Revision 2015/01/06
©2015 Amazing Micro.
4
www.amazingIC.com
Applications Information
A. Design Considerations
The ESD protection scheme for system I/O
connector is shown in the Fig. 1. In Fig. 1, the
diodes D1 and D2 are general used to protect
data line from ESD stress pulse. The diode D3 is
a back-drive protection design, which blocks the
DC back-drive current when the potential of I/O
pin is greater than that of VDD pin. If the
power-rail ESD clamping circuit is not placed
between VDD and GND rails, the positive pulse
ESD current (IESD1) will pass through the ESD
current path1. Thus, the ESD clamping voltage
VCL of data line can be described as follow:
VCL = Fwd voltage drop of D1 + Breakdown
voltage drop of D3 + supply voltage of VDD
rail + L1
× d(I
ESD1)/dt + L2
× d(I
ESD1)/dt
Where L1 is the parasitic inductance of data line,
and L2 is the parasitic inductance of VDD rail.
An ESD current pulse can rise from zero to its
peak value in a very short time. As an example, a
level 4 contact discharge per the IEC61000-4-2
standard results in a current pulse that rises from
zero to 30A in 1ns. Here d(IESD1)/dt can be
approximated by ∆IESD1/∆t, or 30/(1x10
-9). So just
10nH of total parasitic inductance (L1 and L2
combined) will lead to over 300V increment in
VCL! Besides, the ESD pulse current which is
directed into the VDD rail may potentially
damage any components that are attached to
that rail. Moreover, it is common for the forward
voltage drop of discrete diodes to exceed the
damage threshold of the protected IC. This is due
to the relatively small junction area of typical
discrete components. Of course, the discrete
diode is also possible to be destroyed due to its
power dissipation capability is exceeded.
The
AZC199-04S
has
an
integrated
power-rail ESD clamped circuit between VDD
and GND rails. It can successfully overcome
previous disadvantages. During an ESD event,
the positive ESD pulse current (IESD2) will be
directed through the integrated power-rail ESD
clamped circuit to GND rail (ESD current path2).
The clamping voltage VCL on the data line is
small and protected IC will not be damaged
because power-rail ESD clamped circuit offer a
low impedance path to discharge ESD pulse
current.
Protecte d
IC
VDD rail
GND rail
data line
L 1
L 2
VCL
VESD
D1
D2
power-rail ESD
clamp ing circuit
+
_
Vp
ESD1
I
ESD2
I
AZC199-04S
+
_
ESD current path 1 (I
ESD1)
ESD current path 2 (I
ESD2)
D3
Fig. 1
Application of positive ESD pulse between data line and GND rail.



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