ST25TV02K datasheet(74/90 Pages) STMICROELECTRONICS

Nome de Peças	ST25TV02K

Descrição Electrónicos	NFC Type 5 / RFID tag IC with up to 2-Kbit EEPROM, product identification and protection

PDF	90 Pages

Scroll/Zoom	100%

Fabricante Electrônico	STMICROELECTRONICS [STMicroelectronics]

Página de início	http://www.st.com

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74 / 90 page

Package information

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages,

depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product

status are available at: www.st.com. ECOPACK is an ST trademark.

9.1

Sawn and bumped wafer

Contact your STMicroelectronics sales office to get the document with the detailed description.

9.2

UFDFPN5 (DFN5) package information

UFDFPN5 is a 5-lead, 1.7 × 1.4 mm, 0.55 mm thickness, ultra thin fine pitch dual flat package.

Figure 30. UFDFPN5 - Outline

Top view

(marking side)

Side view

Bottom view

(pads side)

Pin 1

Maximum package warpage is 0.05 mm.

Exposed copper is not systematic and can appear partially or totally according to the cross section.

Drawing is not to scale.

On the bottom side, pin 1 is identified by the specific pad shape and, on the top side, pin 1 is defined from

the orientation of the marking. When reading the marking, pin 1 is below the upper left package corner.

ST25TV02K ST25TV512

Package information

DS12074 - Rev 11

page 74/90

ST25TV02K Folha de dados(PDF) 74 Page - STMicroelectronics