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SPC58EE80C3 Folha de dados(PDF) 68 Page - STMicroelectronics

Nome de Peças SPC58EE80C3
Descrição Electrónicos  32-bit Power Architecture microcontroller for automotive ASIL-D applications
PDF  154 Pages
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Fabricante Electrônico  STMICROELECTRONICS [STMicroelectronics]
Página de início  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

SPC58EE80C3 Folha de dados(HTML) 68 Page - STMicroelectronics

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Electrical characteristics
SPC58EEx, SPC58NEx
68/154
DS11646 Rev 4
3.14
LFAST pad electrical characteristics
The LFAST(LVDS Fast Asynchronous Serial Transmission) pad electrical characteristics
apply to both the SIPI and high-speed debug serial interfaces on the device. The same
LVDS pad is used for the Microsecond Channel (MSC) and DSPI LVDS interfaces, with
different characteristics given in the following tables.
3.14.1
LFAST interface timing diagrams
Figure 9. LFAST and MSC/DSPI LVDS timing definition
Signal excursions above this level NOT allowed
Max. common mode input at RX
Signal excursions below this level NOT allowed
Min. common mode input at RX
Data Bit Period
Minimum Data Bit Time
Opening =
0.55 * T (LFAST)
0.50 * T (MSC/DSPI)
Max Differential Voltage =
285 mV (LFAST)
400 mV (MSC/DSPI)
Min Differential
Voltage =
100 mV (LFAST)
150 mV (MSC/DSPI)
1743 mV
1600 mV
VOS = 1.2 V +/- 10%
TX common mode
VICOM
150 mV
0V
1743 mV
“No-Go”
T = 1 /FDATA
|ΔVOD|
|ΔVOD|
ΔPEREYE
ΔPEREYE
PAD_N
PAD_P



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