TEMPERATURE SPECIFICATIONS (Note 1)

Parameters

Symbol

Min.

Typ.

Max.

Units

Conditions

Temperature Ranges

Storage Temperature Range

–65

—

+150

°C

—

Maximum Junction Temperature Range

–40

—

+150

°C

—

Operating Junction Temperature Range

–40

—

+125

°C

—

Lead Temperature

—

—

—

+260

°C

Soldering, 10s

Package Thermal Resistances

Thermal Resistance 1 mm x 1 mm Thin DFN-4

—

250

—

°C/W

—

Thermal Resistance SOT23-5

—

253

—

°C/W

—

Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable

maximum allowable power dissipation will cause the device operating junction temperature to exceed the

maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability.

 2019 Microchip Technology Inc.

DS20006006B-page 5

MIC5501/2/3/4