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USB4105 Folha de dados(PDF) 6 Page - List of Unclassifed Manufacturers |
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USB4105 Folha de dados(HTML) 6 Page - List of Unclassifed Manufacturers |
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6 / 11 page ![]() PRODUCT SPECIFICATION Part Number USB4105 Rev A1 Date 24/10/19 Product Description USB Type C Receptacle for USB2.0 ,SMT Type, PCB Top Mount Page 6 Doc Number USB Type C Prepared CC Checked VJ Approved PH www.gct.co 7.0 RESISTANCE TO INFRARED REFLOW SOLDERING HEAT Parameter Reference Specification Average temperature gradient in preheating 2.5°C/s Soak time Tsoak 2-3 minutes Time above 217°C T1 60 Time above 230°C T2 50 Time above 250°C T3 5 Peak temperature in reflow Tpeak 255°C(–0/+5°C) Temperature gradient in cooling -5°C/s max Lead Free Process This profile is the minimum requirement for evaluating soldering heat resistance of components. Heat transfer method used for reflow soldering is hot air convection. The actual air temperatures used to achieve the specified profile is higher and largely dependent on the reflow equipment. |
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