DocID031835 Rev 1

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STSPIN840

Electrical data

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2.3

Thermal data

2.4

ESD protection ratings

Table 3. Thermal data

Symbol

Parameter

Conditions

Value Unit

Junction to ambient thermal

resistance

Natural convection, according to

1. Simulated on a 76.2 x 114.3 x 1.6 mm, with vias underneath the component, 2s2p board as per standard

JEDEC (JESD51-7) in natural convection.

36.5

°C/W

Junction to case thermal resistance

(top side)

Cold plate on top package, according

to JESD51-12(1)

27.6

°C/W

Junction to case thermal resistance

(bottom side)

Cold plate on exposed pad,

according to JESD51-12(1)

5.9

°C/W

Junction to board thermal

resistance

According to JESD51-8(1)

13.6

°C/W

Junction to top characterization

According to JESD51-2a(1)

1°C/W

Junction to board characterization

According to JESD51-2a(1)

13.7

°C/W

Table 4. ESD protection ratings

Symbol

Parameter

Conditions

Class Value Unit

HBM

Human body model

Conforming to ANSI/ESDA/JEDEC JS001

H2

2

kV

CDM

Charge device model

Conforming to ANSI/ESDA/JEDEC JS002

All pins

C2a

500

V

Conforming to ANSI/ESDA/JEDEC JS002

Corner pins only (1, 6, 7, 12, 13, 18, 19, 24)

-

750

V

MM

Machine model

Conforming to EIA/JESD22-A115-C

NC

200

V