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STMIPID02/TR Folha de dados(PDF) 43 Page - STMicroelectronics

Nome de Peças STMIPID02/TR
Descrição Electrónicos  Dual mode MIPI CSI-2 / SMIA CCP2 de-serializer
PDF  50 Pages
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Fabricante Electrônico  STMICROELECTRONICS [STMicroelectronics]
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STMIPID02/TR Folha de dados(HTML) 43 Page - STMicroelectronics

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Table 17. VFBGA mechanical data
Reference
Dimensions
Millimeters
Inches
Min.
Typ.
Max.
Min.
Typ.
Max.
A (1)
1.00
0.039
A1
0.125
0.005
A2
0.615
0.024
A3
0.18
0.007
A4
0.45
0.018
b (2)
0.22
0.26
0.30
0.009
0.010
0.012
D
2.95
3.00
3.05
0.116
0.118
0.120
D1
2.40
0.094
E
2.95
3.00
3.05
0.116
0.118
0.120
E1
2.40
0.094
e
0.40
0.016
F
0.30
0.012
ddd
0.08
0.003
eee (3)
0.13
0.005
fff (4)
0.04
0.002
1. VFBGA stands for very thin profile fine pitch ball grid array. Very thin profile: 0.80 mm < A ≤ 1.00 mm / fine pitch: e < 1.00
mm. The maximum total package height is calculated by the following methodology: A2 Typ. + A1 Typ. + square-root(A1
+A3 +A4 tolerance values).
2. The typical ball diameter before mounting is 0.25 mm.
3. The tolerance of the position that controls the location of the pattern of balls with respect to datums A and B. For each ball
there is a cylindrical tolerance zone, eee, perpendicular to datum C and located on the true position with respect to datums
A and B as defined by e. The axis perpendicular to datum C of each ball must lie within this tolerance zone.
4. The tolerance of the position that controls the location of the balls within the matrix with respect to each other. For each ball,
there is a cylindrical tolerance zone, fff, perpendicular to datum C and located on the true position as defined by e. The axis
perpendicular to datum C of each ball must lie within this tolerance zone. Each tolerance zone fff in the array is contained
entirely in the respective zone eee above. The axis of each ball must lie simultaneously in both tolerance zones.
STMIPID02
VFBGA package information
DS12803 - Rev 1
page 43/50



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