ADP5076ACBZ-R7 datasheet(5/23 Pages) AD

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Data Sheet

ADP5076

Rev. A | Page 5 of 23

ABSOLUTE MAXIMUM RATINGS

Table 3.

Parameter

Rating

PVIN, AVIN

−0.3 V to +6 V

SW1

−0.3 V to +40 V

SW2

PVIN − 40 V to PVIN + 0.3 V

PGND, AGND

−0.3 V to +0.3 V

EN1, EN2, FB1, FB2, SYNC

−0.3 V to +6 V

COMP1, COMP2, SLEW, SS,

SEQ, VREF

−0.3 V to AVIN + 0.3 V

Operating Junction

Temperature Range

−40°C to +125°C

Storage Temperature Range

−65°C to +150°C

Soldering Conditions

JEDEC J-STD-020

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL RESISTANCE

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. Careful attention to

PCB thermal design is required.

θJA is the natural convection junction-to-ambient thermal

resistance measured in a one cubic foot sealed enclosure. θJC is

the junction-to-case thermal resistance. ΨJT is the junction-to-

top of package thermal characterization parameter.

θJA and ΨJT are based on a 4-layer PCB (two signal and two

power planes). θJC is measured at the top of the package and is

independent of the PCB. The ΨJT value is more appropriate for

calculating junction to case temperature in the application.

Table 4. Thermal Resistance

Package Type

θJA

θJC

ΨJT

Unit

CB-20-14

0.54

0.13

C/W

ESD CAUTION

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