MPC8347ECVRADDB datasheet(57/99 Pages) NXP

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MPC8347ECVRADDB Folha de dados(PDF) 57 Page - NXP Semiconductors

Nome de Peças	MPC8347ECVRADDB

Descrição Electrónicos	MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications

PDF	99 Pages

Scroll/Zoom	100%

Fabricante Electrônico	NXP [NXP Semiconductors]

Página de início	http://www.nxp.com

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MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 12

Freescale Semiconductor

Package and Pin Listings

18.3

Package Parameters for the MPC8347EA PBGA

The package parameters are as provided in the following list. The package type is 29 mm

× 29 mm,

620 plastic ball grid array (PBGA).

Package outline

29 mm

× 29 mm

Interconnects

620

Pitch

1.00 mm

Module height (maximum)

2.46 mm

Module height (typical)

2.23 mm

Module height (minimum)

2.00 mm

Solder balls

62 Sn/36 Pb/2 Ag (ZQ package)

96.5 Sn/3.5Ag (VR package)

Ball diameter (typical)

0.60 mm

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