A3T18H408W24S

7

RF Device Data

NXP Semiconductors

PRODUCT DOCUMENTATION, SOFTWARE AND TOOLS

Refer to the following resources to aid your design process.

Application Notes

 AN1908: Solder Reflow Attach Method for High Power RF Devices in Air Cavity Packages

 AN1955: Thermal Measurement Methodology of RF Power Amplifiers

Software

 Electromigration MTTF Calculator

 .s2p File

Development Tools

 Printed Circuit Boards

To Download Resources Specific to a Given Part Number:

2. Search by part number

3. Click part number link

4. Choose the desired resource from the drop down menu

REVISION HISTORY

The following table summarizes revisions to this document.

Revision

Date

Description

0

July 2019

 Initial release of data sheet