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600F1R0BT250XT Folha de dados(PDF) 3 Page - NXP Semiconductors

Nome de Peças 600F1R0BT250XT
Descrição Electrónicos  RF Power GaN Transistor
PDF  8 Pages
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Fabricante Electrônico  NXP [NXP Semiconductors]
Página de início  http://www.nxp.com
Logo NXP - NXP Semiconductors

600F1R0BT250XT Folha de dados(HTML) 3 Page - NXP Semiconductors

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Data Sheet: Technical Data
3/8
A3G18D510--04S Airfast RF Power GaN Transistor, Rev. 0, August 2020
Table 4. Electrical Characteristics (TA =25C unless otherwise noted) (continued)
Characteristic
Symbol
Min
Typ
Max
Unit
Functional Tests (1,2) (In NXP Doherty Production Test Fixture, 50 ohm system) VDD =48 Vdc, IDQA = 250 mA, VGSB = –5.0 Vdc,
Pout = 56 W Avg., f = 1805 MHz, Single--Carrier W--CDMA, IQ Magnitude Clipping, Input Signal PAR = 9.9 dB @ 0.01% Probability on CCDF.
ACPR measured in 3.84 MHz Channel Bandwidth @ 5MHz Offset. [See note on correct biasing sequence.]
Power Gain
Gps
15.0
16.0
18.0
dB
Drain Efficiency
D
44.3
54.3
%
Pout @ 3 dB Compression Point, CW
P3dB
53.6
55.1
dBm
Adjacent Channel Power Ratio
ACPR
–26.4
–21.9
dBc
Wideband Ruggedness (In NXP Doherty Production Test Fixture, 50 ohm system) IDQA = 250 mA, VGSB = –5.0 Vdc, f = 1995 MHz, Additive
WhiteGaussian Noise(AWGN)with10dBPAR
ISBW of 400 MHz at 55 Vdc, 228 W Avg. Modulated Output Power
(8.5 dB Input Overdrive from 228 W Avg. Modulated Output Power)
No Device Degradation
Typical Performance (In NXP Doherty Production Test Fixture, 50 ohm system) VDD =48 Vdc, IDQA = 250 mA, VGSB = –5.0 Vdc,
1805–2170 MHz Bandwidth
Pout @ 3 dB Compression Point (2)
P3dB
355
W
AM/PM
(Maximum value measured at the P3dB compression point across
the 1805–2170 MHz bandwidth)
–25
VBW Resonance Point
(IMD Third Order Intermodulation Inflection Point)
VBWres
260
MHz
Gain Flatness in 365 MHz Bandwidth @ Pout =56 W Avg.
GF
1.7
dB
Gain Variation over Temperature
(–40Cto+85C)
G
0.013
dB/C
Output Power Variation over Temperature
(–40Cto+85C)
P1dB
0.013
dB/C
Table 5. Ordering Information
Device
Tape and Reel Information
Package
A3G18D510--04SR3
R3 Suffix = 250 Units, 32 mm Tape Width, 13--inch Reel
NI--780S--4L
1. Part internally input matched.
2. P3dB = Pavg + 7.0 dB where Pavg is the average output power measured using an unclipped W--CDMA single--carrier input signal where
output PAR is compressed to 7.0 dB @ 0.01% probability on CCDF.
NOTE: Correct Biasing Sequence for GaN Depletion Mode Transistors in a Doherty Configuration
Bias ON the device
1. Set gate voltage VGSA and VGSB to –5 V.
2. Set drain voltage VDSA and VDSB to nominal supply voltage (+48 V).
3. Increase VGSA (carrier side) until IDQA current is attained.
4. Increase VGSB (peaking side) to target bias voltage.
5. Apply RF input power to desired level.
Bias OFF the device
1. Disable RF input power.
2. Adjust gate voltage VGSA and VGSB to –5 V.
3. Adjust drain voltage VDSA and VDSB to 0 V. Allow adequate time
for drain voltage to reduce to 0 V from external drain capacitors.
4. Disable VGSA and VGSB.



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