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PCF8553DTT/A Folha de dados(PDF) 43 Page - NXP Semiconductors |
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PCF8553DTT/A Folha de dados(HTML) 43 Page - NXP Semiconductors |
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43 / 51 page ![]() NXP Semiconductors PCF8553 40 × 4 LCD segment driver 20 Footprint information DIMENSIONS in mm Ay By D1 D2 Gy Hy P1 C Gx sot364-1_fr Hx SOT364-1 solder land occupied area Footprint information for reflow soldering of TSSOP56 package Ay By Gy C Hy Hx Gx P1 Generic footprint pattern Refer to the package outline drawing for actual layout P2 (0.125) (0.125) D1 D2 (4x) P2 8.900 6.100 1.400 0.280 0.400 14.270 7.000 9.150 16.600 0.500 0.560 Figure 30. Footprint information for reflow soldering of SOT364-1 (TSSOP56) of PCF8553DTT PCF8553 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2021. All rights reserved. Product data sheet Rev. 4 — 20 April 2021 43 / 51 |
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