MIC863 datasheet(7/26 Pages) MICROCHIP

Nome de Peças	MIC863

Descrição Electrónicos	Dual Ultra-Low Power Op Amp in SOT-23-8

PDF	26 Pages

Scroll/Zoom	100%

Fabricante Electrônico	MICROCHIP [Microchip Technology]

Página de início	http://www.microchip.com

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7 / 26 page

TEMPERATURE SPECIFICATIONS (Note 1)

Parameters

Sym.

Min.

Typ.

Max.

Units

Conditions

Temperature Ranges

Ambient Temperature Range

–40

—

+85

°C

—

Storage Temperature Range

—

+150

°C

—

Lead Temperature

—

+260

°C

Soldering, 10s

Package Thermal Resistance

Thermal Resistance SOT-23-8

JA

—

100

—

°C/W

Using 4-Layer PCB

CA

—

°C/W

Using 4-Layer PCB

Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable

junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the

maximum allowable power dissipation will cause the device operating junction temperature to exceed the

maximum +85°C rating. Sustained junction temperatures above +85°C can impact the device reliability.

 2020 Microchip Technology Inc.

DS20006308A-page 7

MIC863

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