Data Sheet

HMC524ALC3B

Rev. A | Page 5 of 24

PIN CONFIGURATION AND FUNCTION DESCRIPTIONS

HMC524ALC3B

NOTES

1. NIC = NO INTERNAL CONNECTION. THESE

PINS ARE NOT CONNECTED INTERNALLY.

2. EXPOSED PAD. THE EXPOSED PAD MUST

BE CONNECTED TO THE GND PIN.

TOP VIEW

(Not to Scale)

1

GND

7

GND

8

GND

9

LO

10

11

12

4

2

RF

3

GND

5

6

Figure 2. Pin Configuration

Table 4. Pin Function Descriptions

Pin No.

Mnemonic

Description

1, 3, 7, 8, 10

GND

Ground Connect. These pins and package bottom must be connected to RF/dc ground.

2

RF

Radio Frequency Port. This pin is ac coupled and matched to 50 Ω.

4

IF1

First Quadrature Intermediate Frequency Output Pin. For applications not requiring operation to dc, use an off

chip dc blocking capacitor. For operation to dc, these pins must not source/sink more than 2 mA of current or

device nonfunction and possible device failure results.

5, 11, 12

NIC

No Internal Connection. These pins are not connected internally.

6

IF2

Second Quadrature Intermediate Frequency Output Pin. For applications not requiring operation to dc, use an

off chip dc blocking capacitor. For operation to dc, these pins must not source/sink more than 2 mA of current or

device nonfunction and possible device failure results.

9

LO

Local Oscillator Port. The pin is dc coupled and matched to 50 Ω.

EPAD

Exposed Pad. The exposed pad must be connected to the GND pin.

INTERFACE SCHEMATICS

GND

Figure 3. GND Interface Schematic

RF

Figure 4. RF Interface Schematic

IFx

Figure 5. IFx Interface Schematic

LO

Figure 6. LO Interface Schematic