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MCP1650 Folha de dados(PDF) 21 Page - Microchip Technology |
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MCP1650 Folha de dados(HTML) 21 Page - Microchip Technology |
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21 / 28 page ![]() 2004 Microchip Technology Inc. DS21876A-page 21 MCP1650/51/52/53 Figure 6-2 represents the top wiring for the MCP1650/ 51/52/53 application shown. As shown in Figure 6-2, the high-current wiring is short and wide. In this example, a 1 oz. copper layer is used for both the top and bottom layers. The ground plane connected to C2 and R4 are connected through the vias (holes) connecting the top and bottom layer. The feedback signal (from TP2) is wired from the output of the regulator around the high current switching section to the feedback voltage divider and to the FB pin of the MCP1650/51/52/53. FIGURE 6-2: Top Layer Wiring. Figure 6-3 represents the bottom wiring for the MCP1650/51/52/53 application shown. Silk-screen reference designator labels are transparent from the top of the board. The analog ground plane and power ground plane are connected near the ground connection of the input capacitor (C2). This prevents high-power, ground-circulating currents from flowing through the analog ground plane. FIGURE 6-3: Bottom Layer Wiring. |
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