ADPA7009CHIP datasheet(28/28 Pages) AD

Nome de Peças	ADPA7009CHIP

Descrição Electrónicos	20 GHz to 54 GHz, GaAs, pHEMT, MMIC, 29 dBm (0.5 W) Power Amplifier

PDF	28 Pages

Scroll/Zoom	100%

Fabricante Electrônico	AD [Analog Devices]

Página de início	http://www.analog.com

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28 / 28 page

ADPA7009CHIP

Data Sheet

Rev. 0 | Page 28 of 28

OUTLINE DIMENSIONS

2.750

1.845

*This die utilizes fragile air bridges. Any pickup tools used must not contact this area.

TOP VIEW

(CIRCUIT SIDE)

SIDE VIEW

0.572

0.108

0.114

0.389

0.460

0.112

0.354

0.255

0.179

0.220

0.179

0.255

0.175

0.130

0.898

0.102

0.644

0.786

0.197

0.653

0.890

0.100 × 0.100

(Pads 2, 3, 5, 7, 9, 10)

0.240

0.130

0.119

0.118

0.093

0.012

0.898

0.100 × 0.200

(Pads 1 and 6)

0.150 × 0.100

(Pads 4 and 8)

*AIR BRIDGE

AREA

0.104

(Pads 2 - 5)

0.105

(Pads 7 - 10)

0.102

Figure 82. 10-Pad Bare Die [CHIP]

(C-10-13)

Dimensions shown in millimeter

ORDERING GUIDE

Model1, 2

Temperature Range

Package Description

Package Option

ADPA7009CHIP

−55°C to +85°C

10-Pad Bare Die [CHIP]

C-10-13

ADPA7009C-KIT

−55°C to +85°C

10-Pad Bare Die [CHIP]

C-10-13

1 The ADPA7009CHIP and ADPA7009C-KIT are RoHS compliant parts.

2 Die inspected to meet MIL-STD-883 Method 2010, Condition B.

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D26020-3/21(0)

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