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Figure 15. 36-Lead Flatpack, Dual Cavity
(50-Mil Lead Spacing)
Notes:
1. Package material: opaque ceramic.
2. All package plating finishes are per MIL-M-38510.
3. Lid is not connected to any electrical potential.
4. It is recommended that package ceramic be mounted to a heat removal rail located in the
printed circuit board. A thermally conductive material such as Mereco XLN-589 or
equivalent should be used.
1.00+.025
E
0.700
±0.015
L
LEAD 1 INDICATOR
A
0.130 MAX.
Q
0.070
±0.010
(AT CERAMIC BODY)
D
-
e
.050
b
0.016
±.002
C
0.007
-0.001
+0.002