3312 - 2 mm SMD Trimming Potentiometer

SV Series - Special Medium Voltage Varistors

Specifications are subject to change without notice.

Users should verify actual device performance in their specific applications.

Assembly Recommendations for Through-Hole Components

POINT TO BE FIXED

2

(.079)

Very often before soldering through-hole components, their leads

get bent. It is important not to damage the components during lead

bending. Damage most commonly incurred during bending is cracks

in epoxy parts, which can lead to increased humidity sensitivity of a

component and, consequentially, a shorter lifetime.

In order to avoid epoxy damage, it is necessary to:

- fix the most sensitive point (epoxy parts) of a component body

- bend the wire at least 2 mm below the end of epoxy parts

Other potential damage to a component which can lead to component

failure or a shorter lifetime is thermal shock during manual soldering

with a soldering iron. This can occur when a soldering iron is placed

too close to one point of the component body and it happens most

often when the solder joint is too close to the varistor body.

Resistance to Soldering Heat

In the case of automatic wave soldering, it is important to provide sufficient resistance to soldering heat. In order to prevent any

potential problems, internal standards were introduced for testing the resistance to soldering heat of through-hole components: 300 °C,

10 seconds.

Pb-free Wave Soldering Profile Recommendations

Recommended soldering profiles for all above components are in accordance with JEDEC standard curves (J-STD-020D) and are,

therefore, compatible with the Pb-free process.

Lead-free Wave Soldering Profile - Pb-free wave profile requirements for soldering heat resistance of components

t1

T1

T2

Tmerit

MELTING POINT 217 °C

TIME

T3

t(w1+w2)

Parameter

Symbol

Specification

Preheating temperature gradient

4 °C/sec. max.

Preheating time

t1

2 to 5 min.

Min. preheating temperature

T1

130 °C

Max. preheating temperature

T2

180 °C

Melting temperature/point

Tmeltv

217 °C

Time in wave soldering phase

(w1+w2)

tw1+w2

10 sec.

Max. wave temperature (w1+w2)

Ts

265 °C +0/-5 °C

Cooling temperature gradient

6° C/sec. max.

Temperature jump from T2 to T3

(w1)

T3(w1) - T2

120 °C max

Time from 25 °C to T3 (wave

temperature)

8 min. max.

DIMENSIONS:

MM

(INCHES)