Solder Reflow Recommendation

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Soak Start

From ambient to soak temperature and soak start 150℃ - 180℃ 2℃ - 4℃ / sec

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Soak end

Soak end

180℃ - 200℃

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Peak Temp. From soak temperature to Peak temperature

260℃

2℃ - 3℃ / sec

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Time above

Main heating time

230℃ - 260℃

40s - 60s

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Cooling

From main heating temperature to 100℃

100℃

Max. 4℃ / sec

Notes:

1* Peak temperature can be high to 260℃, and the recommendation time is as below

at 230℃

40s ~ 60s

at 240℃

30s ~ 40s

at 260℃

5s ~ 10s

2* Recommended reflow methods: IR, Vapor phase oven, hot air oven, wave solder.

3* Devices can be cleaned using standard industry methods and solvents.

4* Component can withstand 270℃ 10 sec.

5* If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements.

Package Information

Tape & Reel: 10000pcs per reel.

2008. 12. 15

4/4

Revision No : 0

PE12A-0402