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LT8636 Folha de dados(PDF) 16 Page - Analog Devices |
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LT8636 Folha de dados(HTML) 16 Page - Analog Devices |
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16 / 32 page ![]() LT8636/LT8637 16 Rev. C For more information www.analog.com APPLICATIONS INFORMATION Figure 1. Recommended PCB Layouts for the LT8636 Low EMI PCB Layout The LT8636/LT8637 is specifically designed to minimize EMI emissions and also to maximize efficiency when switching at high frequencies. For optimal performance the LT8636/LT8637 requires the use of multiple VIN bypass capacitors. Two small 1µF capacitors should be placed as close as possible to the LT8636/LT8637, one capacitor on each side of the device (CIN1, CIN2). A third capacitor with a larger value, 2.2µF or higher, should be placed near CIN1 or CIN2. See Figure 1 for recommended PCB layouts. For more detail and PCB design files refer to the Demo Board guide for the LT8636/LT8637. Note that large, switched currents flow in the LT8636/ LT8637 VIN and GND pins and the input capacitors. The loops formed by the input capacitors should be as small as possible by placing the capacitors adjacent to the VIN and GND pins. Capacitors with small case size such as 0603 are optimal due to lowest parasitic inductance. The input capacitors, along with the inductor and out- put capacitors, should be placed on the same side of the circuit board, and their connections should be made on that layer. Place a local, unbroken ground plane under the application circuit on the layer closest to the surface layer. The SW and BOOST nodes should be as small as possible. Finally, keep the FB and RT nodes small so that the ground traces will shield them from the SW and BOOST nodes. OTHER SIGNAL VIAS VOUT VIA VIN VIA GROUND VIA 8636 F01a R2 C1 R1 CVCC CIN1 CIN2 L COUT CSS RT CIN3 CBST OTHER SIGNAL VIAS VOUT VIA VIN VIA GROUND VIA 8636 F01b R2 C1 CC CF RC R1 CVCC CIN1 CIN2 L COUT CSS RT CIN3 CBST (a) LT8636 (b) LT8637 |
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