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STTS22H Folha de dados(PDF) 20 Page - STMicroelectronics |
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STTS22H Folha de dados(HTML) 20 Page - STMicroelectronics |
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20 / 29 page ![]() 10 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 10.1 Soldering information The UDFN package is compliant with the ECOPACK standard, and it is qualified for soldering heat resistance according to JEDEC J-STD-020. 10.2 UDFN-6L package information Figure 9. UDFN-6L (2.0 x 2.0 x 0.50 mm) package outline and mechanical data 0.25±0.05 (6x) 0÷0.05 A B 0.05 C 0.05 C C 0.07 C A B 0.05 C (6x) 0.65 1.3 1.45±0.1 C0.20 L H Pin 1 Laser Index Area Dimensions are in millimeter unless otherwise specified General Tolerance is +/-0.10mm unless otherwise specified OUTER DIMENSIONS ITEM DIMENSION [mm] TOLERANCE [mm] 5 0 . 0 ± 2 ] L [ h t g n e L 5 0 . 0 ± 2 ] W [ h t d i W / X A M 5 5 . 0 ] H [ t h g i e H DM00423052_1 Dimensions are in millimeters unless otherwise specified. STTS22H Package information DS12606 - Rev 4 page 20/29 |
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