FSV20100V datasheet(2/5 Pages) ONSEMI

2 / 5 page

FSV20100V

www.onsemi.com

THERMAL CHARACTERISTICS (TA = 25°C unless otherwise noted) (Note 1)

Symbol

Characteristic

Minimum

Land Pattern

Maximum

Land Pattern

Unit

RqJA

Junction−to−Ambient Thermal Resistance

100

°C/W

ΨJL

Junction−to−Lead Thermal Characteristics, Thermocouple Soldered to Anode

°C/W

Junction−to−Lead Thermal Characteristics, Thermocouple Soldered to Cathode

1. The thermal resistances (RqJA & ΨJL) are characterized with device mounted on the following FR4 printed circuit boards, as shown in Figure 1

and Figure 2. PCB size: 76.2 x 114.3 mm. Minimum land pattern size: 4.9 x 4.8 mm (big pattern, x1), 1.4 x 1.52 mm (small pattern, x2).

Maximum land pattern size: 30 x 30 mm (pattern, x2). Force line trace size = 55 mils, sense line trace size = 4 mils.

Figure 1. Minimum Land Pattern of 2 oz Copper

Figure 2. Maximum Land Pattern of 2 oz Copper

ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

BVR

Breakdown Voltage

IR = 0.5 mA

100

−

Forward Voltage Drop

IF = 20 A

−

0.66

Reverse Current

VR = 100 V

−

Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product

performance may not be indicated by the Electrical Characteristics if operated under different conditions.

ORDERING INFORMATION

Part Number

Top Mark

Package

Shipping†

FSV20100V

TO−277 3L

(Pb−Free/Halogen Free)

5000 / Tape & Reel

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging

Specifications Brochure, BRD8011/D.

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