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STPMIC1APQR Folha de dados(PDF) 7 Page - STMicroelectronics

Nome de Peças STPMIC1APQR
Descrição Electrónicos  Highly integrated power management IC for micro processor units
PDF  140 Pages
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Fabricante Electrônico  STMICROELECTRONICS [STMicroelectronics]
Página de início  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STPMIC1APQR Folha de dados(HTML) 7 Page - STMicroelectronics

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3
Electrical and timing characteristics
3.1
Absolute maximum ratings
Table 4. Absolute maximum ratings
Parameter
Min.
Unit
VIN, BUCKxIN, SWIN, LDO3IN, LDOxxIN, PONKEYn
-0.5 to 7
V
VIO, SDA, SCL, RSTn, PWRCTRL, INTn, WAKEUP
-0.5 to 4.2
V
INTLDO
-0.5 to 2
V
VLXx
-0.5 to 7
V
VOUT1, VOUT2
-0.5 to 3
V
VOUT3, VOUT4
-0.5 to 5
V
BSTOUT, VBUSOTG, VLXBST, SWOUT
-0.5 to 7
V
LDOxOUT, VREFDDR
-0.5 to 5
V
TSTO storage temperature
-65 to 150
°C
ESD human body model
±1000
V
ESD charge device model
±500
V
Note:
Once the normal operating conditions are exceeded, the performance of the device may suffer. Stresses beyond
those listed under absolute maximum ratings may cause permanent damage to the device.
3.2
Thermal characteristics
Table 5. Thermal characteristics
Symbol
Parameter
Min.
Max.
Unit
TJ
Operating junction temperature
-40
125
°C
TJAMR
Absolute maximum junction temperature
-40
160
°C
TA
Operating ambient temperature
-40
105
°C
ѲJC
Junction-case package thermal resistance JEDEC
reference (JESD51-12.01)
7
°C/W
ѲJA
Junction-ambient package thermal resistance on
2s2p std JEDEC board (JESD51-7)
29
STPMIC1
Electrical and timing characteristics
DS12792 - Rev 7
page 7/140



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