High current connectors

–5–

ACCTB100E 201803-T

Design of PC board patterns

Conduct the recommended foot pattern design, in order to

preserve the mechanical strength of terminal solder areas.

Recommended PC board and metal mask patterns

Connectors are mounted with high pitch density, intervals of 0.35

mm, 0.4 mm or 0.5 mm. In order to reduce solder and flux rise,

solder bridges and other issues make sure the proper levels of

solder is used.

The figures are recommended patterns. Please use them as a

reference.

Socket (Mated height: 0.6 mm)

Recommended PC board pattern

(TOP VIEW)

Recommended metal mask pattern

Metal mask thickness: When 100

μm

(Terminal opening ratio: 70%)

(Metal-part opening ratio: 46%)

Header (Mated height: 0.6 mm)

Recommended PC board pattern

(TOP VIEW)

Recommended metal mask pattern

Metal mask thickness: When 100

μm

(Signal terminal opening ratio: 70%)

(Power terminal opening ratio: 77%)

0.435±0.03

：Resist on

pattern

：Insulation area

0.28±0.03

1.325±0.03

0.60±0.03

0.35±0.03

0.20±0.03

12×Ｃ0.15

0.18±0.01

0.35±0.01

8×Ｃ0.15

0.435±0.01

1.325±0.01

0.24±0.01

0.60±0.01

Please refer to the latest product specifications when

designing your product.

：Resist on

pattern

：Insulation area

0.35±0.03

0.20±0.03

1.045±0.03

0.26±0.03

0.35±0.01

0.18±0.01

0.885±0.01

0.20±0.01