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MWCT2004AFVMHPR Folha de dados(PDF) 56 Page - NXP Semiconductors |
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MWCT2004AFVMHPR Folha de dados(HTML) 56 Page - NXP Semiconductors |
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56 / 65 page ![]() J12 J10 J11 Input data valid Output data valid TCLK TDI/TMS TDO J14 TDO J13 Figure 26. Test Access Port timing Thermal attributes 7.1 Description The tables in the following sections describe the thermal characteristics of the device. NOTE Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting side (board) temperature, ambient temperature, air flow, power dissipation or other components on the board, and board thermal resistance. 7.2 Thermal characteristics 7 Thermal attributes MWCT101XS Data Sheet, Rev. 3, 12/2019 56 NXP Semiconductors |
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