MWCT2016AFVLHPR datasheet(11/65 Pages) NXP

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5. VREFH should always be equal to or less than VDDA + 0.1 V and VDD + 0.1 V

6. Open drain outputs must be pulled to VDD.

7. When input pad voltage levels are close to VDD or VSS, practically no current injection is possible.

4.3 Thermal operating characteristics

Table 3. Thermal operating characteristics for 64-pin LQFP and 100-pin LQFP and MAPBGA

packages

Symbol

Parameter

Value

Unit

Min.

Typ.

Max.

TA C-Grade Part

Ambient temperature under bias

−40

—

851

℃

TJ C-Grade Part

Junction temperature under bias

−40

—

1051

℃

TA V-Grade Part

Ambient temperature under bias

−40

—

1051

℃

TJ V-Grade Part

Junction temperature under bias

−40

—

1251

℃

TA M-Grade Part

Ambient temperature under bias

−40

—

1252

℃

TJ M-Grade Part

Junction temperature under bias

−40

—

1352

℃

1. Values mentioned are measured at ≤ 112 MHz in HSRUN mode.

2. Values mentioned are measured at ≤ 80 MHz in RUN mode.

4.4 Power and ground pins

VDD

VDDA

VREFH

VREFL

VSSA/VSS

VDD

VSS

100 LQFP

Package

CDEC

144 LQFP

Package

CDEC

VDD

VSS

CDEC

VDD

VDDA

VREFH

VREFL

VSS

VDD

VSS

VSSA/VSS

VDD

VSS

VDDA

VREFH

VREFL/VSSA/VSS

64 LQFP

Package

VDD

NOTE: VDD and VDDA must be shorted to a common source on PCB

Figure 4. Pinout decoupling

Table 4. Supplies decoupling capacitors 1, 2

Symbol

Description

Min. 3

Typ.

Max.

Unit

CREF, 4, 5

ADC reference high decoupling capacitance

100

—

Table continues on the next page...

General

MWCT101XS Data Sheet, Rev. 3, 12/2019

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