Specifications

USB: 4x USB v. 3.0 (USB 0,1,2,3) and 4x USB 2.0 (USB 4,5,6,7)

SATA: Four ports SATA 6Gb/s (SATA0,1,2,3)

Serial: 2 UART ports with console redirection

GPIO: 4 GPO and 4 GPI

Supported on carrier if needed (standard support for W83627DHG-P)

Chipset: Infineon

Type: TPM 2.0

Standard Input: ATX = 12V±5% / 5Vsb ±5% or AT = 12V±5%

Wide Input: ATX = 8.5-20 V / 5Vsb ±5% or AT = 8.5 ~20V (Standard temp. only)

Management: ACPI 5.0 compliant, Smart Battery support

Power States: C1-C6, S0, S1, S3, S4, S5 , S5 ECO mode (Wake-on-USB S3/S4,

WOL S3/S4/S5)

ECO mode: Supports deep S5 mode for power saving

Standard Support

Windows 10 64-bit, Linux 64-bit, VxWorks

Extended Support (BSP)

Linux 64-bit, VxWorks

Form Factor: PICMG COM.0, Rev 2.1 Type 6

Dimension: Basic size, 125 mm x 95 mm

Operating Temperature

Standard: 0°C to 60°C

Extreme Ruggeed: -40°C to +85°C (build option for 25W TDP SKUs)

Humidity

5-90% RH operating, non-condensing

5-95% RH storage (and operating with conformal coating)

Shock and Vibration

IEC 60068-2-64 and IEC-60068-2-27

MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A,

Table 214-I, Condition D

HALT

Thermal Stress, Vibration Stress, Thermal Shock and Combined Test

Local management, control of embedded computer systems

Extended EAPI for monitoring, controlling and analytics applications

Multiple OS support and across platforms (x86, ARM)

Note: “build option” indicates an alternative BOM configuration to support additional or alternative functions that are not available on the standard product.

Be aware that these “build option” part numbers will need to be newly created and this will result in production lead times.