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ST33TPHF2ESPI Folha de dados(PDF) 24 Page - STMicroelectronics

Nome de Peças ST33TPHF2ESPI
Descrição Electrónicos  Flash-memory-based device combining TPM 1.2 and TPM 2.0 with an SPI interface
PDF  26 Pages
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Fabricante Electrônico  STMICROELECTRONICS [STMicroelectronics]
Página de início  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

ST33TPHF2ESPI Folha de dados(HTML) 24 Page - STMicroelectronics

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List of tables
Table 1.
Pin descriptions ..................................................................... 5
Table 2.
TSSOP28 - mechanical data ............................................................ 9
Table 3.
VFQFPN32 - mechanical data .......................................................... 11
Table 4.
Thermal characteristics............................................................... 13
Table 5.
Packages on tape and reel ............................................................ 14
Table 6.
Reel dimensions ................................................................... 14
Table 7.
Carrier tape dimensions for VFQFPN 5 × 5 mm .............................................. 15
Table 8.
Carrier tape constant dimensions for TSSOP 4.4 mm body width .................................. 16
Table 9.
Ordering information for ST33TPHF2ESPI products ........................................... 18
Table 10.
Firmware image overview for the ST33TPHF2ESPI products..................................... 19
Table 11.
Commercial product supporting the update with firmware image version 73.20 ........................ 19
Table 12.
Commercial product supporting the update with firmware image version 73.64 ........................ 19
Table 13.
List of abbreviations ................................................................. 21
Table 14.
Document revision history ............................................................. 22
ST33TPHF2ESPI
List of tables
DB2716 - Rev 4
page 24/26



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