Notes:

1. Dimensions in mm.

2. Tolerance ± 0.1 mm unless otherwise noted.

Device Selection Guide

Footprint

AS AlInGaP

AS AlInGaP

AS AlInGaP

TS AlInGaP

Package

Amber

Orange

Red

Red

Description

GHB-0805DU-O GHB-0805DU-R

GHB0805DU-R2

Untinted, Diffused

A

Tbsolute Maximum Ratings

= 25°C

A

Parameter

Units

[1,2]

DC Forward Current

30

30

mA

Power Dissipation

75

81

mW

5

5

V

LED Junction Temperature

95

95

°

C

Operating Temperature Range

Ð30 to +85

Ð30 to +85

°

C

Storage Temperature Range

Ð40 to +85

Ð40 to +85

°

C

Soldering Temperature

See IR soldering profile (Figure 7)

Notes:

1. Derate linearly as shown in Figure 4.

2. Drive currents above 5 mA are recommended for best long term performance.

GHB-0805DU-Y

GHB-0805DU-O

GHB-0805DU-R

GHB-0805DU-R2

Electrical Characteristics

Forward Voltage

Reverse Breakdown

Capacitance C

Thermal

Resistance

@ I = 20 mA

@ I= 100mA

f = 1 MHz

Rq

= °(C/W)

F

R

J-PIN

Parameter Number

Typ.

Max.

Min.

Typ.

Typ.

GHB-0805DU-Y

1.9

2.4

5

45

300

GHB-0805DU-O

1.9

2.4

5

45

300

GHB-0805DU-R

1.9

2.4

5

45

300

GHB-0805DU-R2

2.2

2.6

5

35

300