0

0

Time (sec)

30

60

90

120

150

180

210

240

270

300

25

50

75

100

125

150

175

200

225

250

Note 1: Temperatures are taken and monitored at the component copper layer

Note 2: Optimum profile may differ due to oven type, circuit board or assembly layout

Note 3: Recommended lead free, no-clean solder: AIM NC254-SAC305

Note 4: Refer to APN-001473 soldering and handling application note for additional solder profiles and details

Note 5: MSL- 1 Level

Solder Profile

14

PDS-001540 Rev 15

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175 New Boston Street • Woburn, MA 01801

Lead free solder guideline for low density boards

Solder Profile Stage

Lead-Free Solder

Profile length, Ambient to Peak

2.75 - 3.5 minutes

Time above 217º C

30 - 60 seconds

Cooldown Rate

≤4º C/sec

Cooldown duration

45 ± 15 sec

SAC 305 Reflow Profile Window For Low Density Boards

SBT-90 Product Datasheet