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LM2903-Q1, LM2903B-Q1

www.ti.com

SLCS141I – MAY 2003 – REVISED JUNE 2020

Product Folder Links: LM2903-Q1 LM2903B-Q1

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Copyright © 2003–2020, Texas Instruments Incorporated

6.5 Recommended Operating Conditions, LM2903B-Q1

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

3

36

V

–40

125

°C

–0.1

(V+) – 2

V

6.6 Recommended Operating Conditions, LM2903-Q1

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

2

30

V

2

32

V

Junction Temperature

-40

125

°C

6.7 Recommended Operating Conditions, LM2903E-Q1

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

2

30

V

Junction Temperature

-40

150

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.8 Thermal Information, LM2903-Q1 and LM2903E-Q1

LM2903E-Q1

LM2903-Q1

UNIT

PW

(TSSOP)

DGK

(VSSOP)

PW

(TSSOP)

D

(SOIC)

8 PINS

8 PINS

8 PINS

8 PINS

Junction-to-ambient thermal resistance

178.9

199.4

186.6

126.0

°C/W

70.7

120.8

79.6

74.2

Junction-to-board thermal resistance

108.9

90.2

116.5

66.4

Junction-to-top characterization parameter

11.9

21.5

17.7

25.4

Junction-to-board characterization parameter

107.3

119.1

114.9

65.9

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.9 Thermal Information, LM2903B-Q1

LM2903B-Q1

UNIT

D

(SOIC)

DGK

(VSSOP)

PW

(TSSOP)

DSG

(WSON)

DDF

(SOT-23)

8 PINS

8 PINS

8 PINS

8 PINS

8 PINS

Junction-to-ambient thermal resistance

148.5

193.7

200.6

96.9

197.9

°C/W

90.2

82.9

89.6

119.0

119.2

Junction-to-board thermal resistance

91.8

115.5

131.3

63.1

115.4

Junction-to-top characterization parameter

38.5

20.8

22.1

12.4

19.4

Junction-to-board characterization parameter

91.1

113.9

129.6

63.0

113.7

-

-

-

38.7

-