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AMC3301 Folha de dados(PDF) 5 Page - Texas Instruments |
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AMC3301 Folha de dados(HTML) 5 Page - Texas Instruments |
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5 / 37 page ![]() 6.4 Thermal Information THERMAL METRIC(1) AMC3301-Q1 UNIT DWE (SOIC) 16 PINS RθJA Junction-to-ambient thermal resistance 73.5 °C/W RθJC(top) Junction-to-case (top) thermal resistance 31 °C/W RθJB Junction-to-board thermal resistance 44 °C/W YJT Junction-to-top characterization parameter 16.7 °C/W YJB Junction-to-board characterization parameter 42.8 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance n/a °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 6.5 Power Ratings PARAMETER TEST CONDITIONS MIN TYP MAX UNIT PD Maximum power dissipation VDD = 5.5 V 231 mW VDD = 3.6 V 151 www.ti.com AMC3301-Q1 SBASA73 – JULY 2020 Copyright © 2020 Texas Instruments Incorporated Submit Document Feedback 5 Product Folder Links: AMC3301-Q1 |
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