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SPMU365C – March 2014 – Revised October 2016

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Copyright © 2014–2016, Texas Instruments Incorporated

Contents

Contents

1

Board Overview

................................................................................................................... 4

1.1

Kit Contents

................................................................................................................... 5

1.2

Using the Connected LaunchPad

......................................................................................... 5

1.3

Features

....................................................................................................................... 5

1.4

BoosterPacks

................................................................................................................. 6

1.5

Energ

īa

........................................................................................................................ 6

1.6

Specifications

................................................................................................................. 6

2

Hardware Description

........................................................................................................... 7

2.1

Functional Description

...................................................................................................... 7

2.1.1

Microcontroller

....................................................................................................... 7

2.1.2

Ethernet Connectivity

............................................................................................... 8

2.1.3

USB Connectivity

................................................................................................... 8

2.1.4

Motion Control

....................................................................................................... 8

2.1.5

User Switches and LED's

.......................................................................................... 8

2.1.6

BoosterPacks and Headers

....................................................................................... 9

2.2

Power Management

........................................................................................................ 20

2.2.1

Power Supplies

.................................................................................................... 20

2.2.2

Low Power Modes

................................................................................................ 21

2.2.3

Clocking

............................................................................................................ 21

2.2.4

Reset

................................................................................................................ 21

2.3

Debug Interface

............................................................................................................. 21

2.3.1

In-Circuit Debug Interface (ICDI)

................................................................................ 21

2.3.2

External Debugger

................................................................................................ 22

2.3.3

Virtual COM Port

.................................................................................................. 22

3

Software Development

........................................................................................................ 23

3.1

Software Description

....................................................................................................... 23

3.2

Source Code

................................................................................................................ 23

3.3

Tool Options

................................................................................................................ 23

3.4

Programming the Connected LaunchPad

............................................................................... 24

4

References, PCB Layout, and Bill of Materials

....................................................................... 25

4.1

References

.................................................................................................................. 25

4.2

Component Locations

..................................................................................................... 26

4.3

Bill of Materials

............................................................................................................. 27

5

Schematic

......................................................................................................................... 30

Revision History

.......................................................................................................................... 31