www.ti.com

ABSOLUTE MAXIMUM RATINGS

(1)

1

2

3

4

8

7

6

5

I

E

B

V

− = −5V

C

V+ = +5V

NC

NC

SO−8

Top View

1

2

3

6

5

4

I

−V

S

B

+V

S

C

E

SOT23−6

OPA861

SBOS338 – AUGUST 2005

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated

circuits be handled with appropriate precautions. Failure to observe proper handling and installation

procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision

integrated circuits may be more susceptible to damage because very small parametric changes could

cause the device not to meet its published specifications.

SPECIFIED

PACKAGE

TEMPERATURE

PACKAGE

ORDERING

TRANSPORT MEDIA,

PRODUCT

PACKAGE

DESIGNATOR

RANGE

MARKING

NUMBER

QUANTITY

OPA861ID

Rails, 75

OPA861

SO-8

D

–45

°C to +85°C

OPA861

OPA861IDR

Tape and Reel, 2500

OPA861IDBVT

Tape and Reel, 250

OPA861

SOT23-6

DBV

–45

°C to +85°C

N5R

OPA861IDBVR

Tape and Reel, 3000

(1)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

web site at www.ti.com.

Power Supply

±6.5V

DC

Internal Power Dissipation

See Thermal Information

Differential Input Voltage

±1.2V

Input Common-Mode Voltage Range

±V

S

Storage Temperature Range: D

–40

°C to +125°C

Lead Temperature (soldering, 10s)

+260

°C

+150°C

ESD Rating:

1500V

Charge Device Model (CDM)

1000V

(1)

Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may

degrade device reliability. These are stress ratings only, and functional operations of the device at these and any other conditions

beyond those specified is not supported.

(2)

Pin 2 for the SO-8 package > 500V HBM. Pin 4 for the SOT23-6 package > 500V HBM.

PIN CONFIGURATION

2