TPS25750 datasheet(8/67 Pages) TI1

8 / 67 page

MIN

MAX

UNIT

VGS

VGATE_VBUS - VVBUS,

VGATE_SYS - VVSYS

–0.5

(1)

All voltage values are with respect to network GND. Connect the GND pin directly to the GND plane of the board.

(2)

Do not apply voltage to these pins.

7.2 ESD Ratings

PARAMETER

TEST CONDITIONS

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human body model (HBM), per ANSI/

ESDA/JEDEC JS-001, all pins(1)

±1000

Charged device model (CDM), per

JEDEC specificationJESD22-C101, all

pins(2)

±500

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommeded Operating Conditions

7.3.1 TPS25750D - Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Input voltage range

(1)

VIN_3V3

3.0

3.6

PP5V

4.9

5.5

ADCIN1, ADCIN2,VBUS_IN,

VBUS

(2)

PPHV

VIO

I/O voltage range

(1)

I2C_SDA, I2C_SCL, ADCIN1,

ADCIN2

3.6

PWR_SRC, PWR_C0, PWR_C1,

USB3, CBL_DIR, DTA_RLE,

FLT_OCP, PWR_ERR, USB_P,

USB_N

5.5

CC1, CC2

5.5

Output current (from PP5V)

VBUS

CC1, CC2

315

IPP_HV

Current from VBUS_IN to PPHV

Output current (from VBUS LDO)

Current from LDO_3V3

Ambient operating temperature

IPP_5V ≤ 3 A, IPP_HV = 0, IPP_CABLE

≤ 315 mA

–40

°C

IPP_5V ≤ 1.5 A, IPP_HV = 0,

IPP_CABLE ≤ 315 mA

–40

105

IPP_5V = 0, IPP_HV ≤ 7 A, IPP_CABLE

= 0

–40

IPP_5V = 0, IPP_HV ≤ 6 A, IPP_CABLE

= 0

–40

IPP_5V = 0, IPP_HV ≤ 5 A, IPP_CABLE

≤ 315 mA

–40

IPP_5V = 0, IPP_HV ≤ 3.5 A,

IPP_CABLE ≤ 315 mA

–40

105

TJ_PPHV

Operating junction temperature

PP_HV switch

–40

150

°C

Operating junction temperature

–40

125

°C

(1)

All voltage values are with respect to network GND. All GND pins must be connected directly to the GND plane of the board.

TPS25750

SLVSFR7 – JULY 2020

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