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MMA8652FC Folha de dados(PDF) 59 Page - NXP Semiconductors |
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MMA8652FC Folha de dados(HTML) 59 Page - NXP Semiconductors |
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59 / 65 page ![]() MMA8652FC Sensors Freescale Semiconductor, Inc. 59 Figure 16. Package mounting measurements Table 114. Board mounting guidelines Description Value (mm) Landing Pad Width 0.225 Landing Pad Length 0.600 Solder Mask Pattern Width 0.725 Solder Mask Pattern Length 1.950 Landing Pad Extended Length 0.200 I/O Pads Extended Length 2.525 0.225 0.200 0.600 1.950 0.725 Solder mask opening PCB landing pad 2x2 DFN Package All measurements are in mm. Package outline 2.525 |
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