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SD25-2R2 Folha de dados(PDF) 2 Page - Monolithic Power Systems |
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SD25-2R2 Folha de dados(HTML) 2 Page - Monolithic Power Systems |
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2 / 18 page ![]() MPQ2451-5/33―36V, 2.2MHz, 0.6A, STEP-DOWN CONVERTER, AEC-Q100 QUALIFIED MPQ2451-5/33 Rev 1.0 www.MonolithicPower.com 2 5/25/2016 MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited. © 2016 MPS. All Rights Reserved. ORDERING INFORMATION Part Number Package Top Marking MPQ2451GT-5* SOT23-6L AGE MPQ2451GT-5-AEC1 MPQ2451GT-33** AGF MPQ2451GT-33-AEC1 MPQ2451GG-5 QFN-6L BP MPQ2451GG-5-AEC1 MPQ2451GG-33 BQ MPQ2451GG-33-AEC1 * For Tape & Reel, add suffix –Z (e.g. MPQ2451GT-5–AEC1-Z) ** For Tape & Reel, add suffix -Z (e.g. MPQ2451GT-33-Z) PACKAGE REFERENCE OUT OUT SOT23-6L QFN-6L ABSOLUTE MAXIMUM RATINGS (1) Supply Voltage (VIN).................... −0.3V to +40V Switch Voltage (VSW)........... −0.3V to (VIN+0.3V) BST to SW.................................... −0.3 to +5.0V All Other Pins............................. –0.3V to +5.0V Continuous Power Dissipation (TA = 25°C) (2) SOT23-6L ................................................0.57W QFN-6L....................................................1.56W Junction Temperature .............................. 150°C Lead Temperature ................................... 260°C Storage Temperature.............. −65°C to +150°C Recommended Operating Conditions (3) Supply Voltage VIN .......................... 3.3V to 36V Operating Junction Temp. (TJ).−40°C to +125°C Thermal Resistance (4) θJA θJC SOT23-6L..............................220 .... 110 ..°C/W QFN-6L...................................80 ...... 16 ...°C/W Notes: 1) Exceeding these ratings may damage the device. 2) The maximum allowable power dissipation is a function of the maximum junction temperature TJ (MAX), the junction-to- ambient thermal resistance θ JA, and the ambient temperature TA. The maximum allowable continuous power dissipation at any ambient temperature is calculated by PD (MAX) = (TJ (MAX)-TA)/θJA. Exceeding the maximum allowable power dissipation will cause excessive die temperature, and the regulator will go into thermal shutdown. Internal thermal shutdown circuitry protects the device from permanent damage. 3) The device is not guaranteed to function outside of its operating conditions. 4) Measured on JESD51-7, 4-layer PCB. |
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