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MMBZXAL Folha de dados(PDF) 8 Page - Nexperia B.V. All rights reserved |
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MMBZXAL Folha de dados(HTML) 8 Page - Nexperia B.V. All rights reserved |
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8 / 18 page ![]() MMBZXAL_SER_2 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 02 — 10 December 2009 7 of 17 NXP Semiconductors MMBZxAL series Low capacitance unidirectional double ESD protection diodes 6. Thermal characteristics [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2. [3] Measured from pin 1 or 2 to pin 3. Table 9. Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit Per device Rth(j-a) thermal resistance from junction to ambient in free air MMBZxAL series [1] - - 460 K/W MMBZ5V6AL MMBZ6V2AL MMBZ6V8AL [2] - - 420 K/W MMBZ9V1AL MMBZ10VAL MMBZ12VAL MMBZ15VAL MMBZ18VAL MMBZ20VAL MMBZ27VAL MMBZ33VAL [2] - - 340 K/W Rth(j-sp) thermal resistance from junction to solder point [3] MMBZ5V6AL MMBZ6V2AL MMBZ6V8AL - - 150 K/W MMBZ9V1AL MMBZ10VAL MMBZ12VAL MMBZ15VAL MMBZ18VAL MMBZ20VAL MMBZ27VAL MMBZ33VAL --50 K/W |
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