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OPA607 Folha de dados(PDF) 16 Page - Texas Instruments |
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OPA607 Folha de dados(HTML) 16 Page - Texas Instruments |
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16 / 21 page ![]() V- OUTPUT GND GND GND 16 OPA607 SBOS981 – OCTOBER 2019 www.ti.com Product Folder Links: OPA607 Submit Documentation Feedback Copyright © 2019, Texas Instruments Incorporated 9 Power Supply Recommendations The OPA607 is specified for operation from 2.2 V to 5.5 V (±1.1 V to ±2.75 V), applicable from –40°C to +125°C. Place 0.1-µF bypass capacitors close to the power-supply pins to reduce errors coupling in from noisy or high- impedance power supplies. CAUTION Supply voltages larger than 6 V can permanently damage the device (see the Absolute Maximum Ratings table). For more detailed information on bypass capacitor placement, see the Layout Guidelines section. 10 Layout 10.1 Layout Guidelines For best operational performance of the device, use good printed circuit board (PCB) layout practices, including: • Noise can propagate into analog circuitry through the power-supply pins of the circuit as a whole and of the operational amplifier. Bypass capacitors are used to reduce the coupled noise by providing low- impedance power sources local to the analog circuitry. – Connect low-equivalent series resistance (ESR), 0.1-µF ceramic bypass capacitors between each supply pin and ground, placed as close to the device as possible. A single bypass capacitor from V+ to ground is applicable for single-supply applications. • Separate grounding for analog and digital portions of the circuitry is one of the simplest and most effective methods of noise suppression. One or more layers on multilayer PCBs are usually devoted to ground planes. A ground plane helps distribute heat and reduces electromagnetic interference (EMI) noise pickup. Make sure to physically separate digital and analog grounds, paying attention to the flow of the ground current. • To reduce parasitic coupling, run the input traces as far away from the supply or output traces as possible. If these traces cannot be kept separate, crossing the sensitive trace perpendicularly is much better than crossing in parallel with the noisy trace. • Place the external components as close to the device as possible. Keeping RF and RG close to the inverting input minimizes parasitic capacitance; see Figure 12 and Figure 13. • Keep the length of input traces as short as possible. Always remember that the input traces are the most sensitive part of the circuit. • Consider a driven, low-impedance guard ring around the critical traces. A guard ring can significantly reduce leakage currents from nearby traces that are at different potentials. 10.2 Layout Examples Figure 12. Operational Amplifier Board Layout for a Noninverting Configuration |
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