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STM32L4A6VG Folha de dados(PDF) 10 Page - STMicroelectronics |
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STM32L4A6VG Folha de dados(HTML) 10 Page - STMicroelectronics |
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10 / 282 page ![]() List of tables STM32L4A6xG 10/282 DS11584 Rev 8 Table 129. WLCSP – 100 ball, 4.618 x 4.142 mm, 0.4 mm pitch wafer level chip scale package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 269 Table 130. WLCSP100 recommended PCB design rules (0.4 mm pitch) . . . . . . . . . . . . . . . . . . . . . 270 Table 131. LQFP - 64-pin, 10 x 10 mm low-profile quad flat package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 272 Table 132. Package thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 275 Table 133. STM32L4A6xG ordering information scheme. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 278 Table 134. Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 279 |
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