Preliminary

PUI Audio, Inc. A Projects Unlimited Company, 3541 Stop Eight Road, Dayton, OH 45414

Tel: (937) 415-5901 Fax: (937) 415-5925

Solder Reflow Profile

Handling Instructions

PUI Audio’s piezoelectric MEMS microphones are very robust to harsh environments such as dust and

moisture. However, to avoid mechanical damage to the microphone, we recommend using

appropriate handling procedures when manually handling the parts or when using pick and place

equipment. The following guidelines will help to avoid damage:

 Do not apply a vacuum to the bottom side of the microphone. A vacuum pen may be used with

care on the top side only.

 Do not apply very high air pressure over the port hole.

 Do not insert any large particles or objects in the port hole. The microphone is robust to small

particles per IP5x specification.

 Do not board wash or clean after the reflow process or expose the acoustic port to harsh

chemicals.