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Audio Inc. is prohibited.

©2017, PUI Audio Inc.

PUI Audio, Inc. A Projects Unlimited Company, 3541 Stop Eight Road, Dayton, OH 45414

Tel: (937) 415-5901 Fax: (937) 415-5925

Solder Reflow Profile

Handling Instructions

The Piezo MEMS microphone is very robust to harsh environments such as dust and moisture. However, to

avoid mechanical damage to the microphone, we recommend using appropriate handling procedures when

manually handling the parts, or when using pick-and-place equipment. The following guidelines will help to

avoid damage:

 Do not apply a vacuum to the bottom side of the microphone. A vacuum pen may be used with care on

the top side only.

 Do not apply very high air pressure over the sound port hole.

 Do not insert any large particles or objects in the sound port hole. The microphone is resistant to

small particles per IP5X specification.

 Do not board wash or clean after the reflow process or expose the sound port to harsh chemicals.

 Do not cover the sound port with tape during the solder reflow process.