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V62/12615-01XE-R Folha de dados(PDF) 3 Page - Texas Instruments

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Nome de Peças V62/12615-01XE-R
Descrição Electrónicos  PHYTER??Military Temperature Single Port 10/100 Mbps Ethernet Physical Layer Transceiver
PDF  97 Pages
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Fabricante Electrônico  TI1 [Texas Instruments]
Página de início  http://www.ti.com
Logo TI1 - Texas Instruments

V62/12615-01XE-R Folha de dados(HTML) 3 Page - Texas Instruments

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DP83848-EP
www.ti.com
SLLSEC6E – SEPTEMBER 2012 – REVISED JUNE 2019
Submit Documentation Feedback
Product Folder Links: DP83848-EP
Revision History
Copyright © 2012–2019, Texas Instruments Incorporated
Table of Contents
1
Device Overview
......................................... 1
1.1
Features
.............................................. 1
1.2
Applications
........................................... 1
1.3
Description
............................................ 1
1.4
Functional Block Diagram
............................ 2
2
Revision History
......................................... 3
3
Pin Configuration and Functions
..................... 4
3.1
Package Pin Assignments
............................ 6
4
Specifications
........................................... 12
4.1
Absolute Maximum Ratings
......................... 12
4.2
ESD Ratings
........................................ 12
4.3
Recommended Operating Conditions
............... 12
4.4
Thermal Information
................................. 12
4.5
DC Specifications
................................... 13
4.6
Electrical Characteristics
............................ 13
4.7
AC Specifications
.................................... 14
5
Detailed Description
................................... 32
5.1
Overview
............................................ 32
5.2
Functional Block Diagram
........................... 32
5.3
Feature Description
................................. 33
5.4
Device Functional Modes
........................... 38
5.5
Programming
........................................ 44
5.6
Memory
.............................................. 54
6
Application and Implementation
.................... 75
6.1
Application Information
.............................. 75
6.2
Typical Application
.................................. 75
7
Power Supply Recommendations
.................. 82
8
Layout
.................................................... 83
8.1
Layout Guidelines
................................... 83
8.2
Layout Example
..................................... 86
8.3
Thermal Vias Recommendation
.................... 86
9
Device and Documentation Support
............... 88
9.1
Documentation Support
............................. 88
9.2
Community Resources
.............................. 88
9.3
Trademarks
.......................................... 88
9.4
Electrostatic Discharge Caution
..................... 88
9.5
Export Control Notice
............................... 88
9.6
Glossary
............................................. 88
10
Mechanical, Packaging, and Orderable
Information
.............................................. 89
2
Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision D (December 2015) to Revision E
Page
Updated document format to current data sheet standard
...................................................................... 1
Changed Ordering Information table to Device Information table
.............................................................. 1
Changed Terminal Descriptions section to Pin Configuration and Functions section
....................................... 4
Added Package Pin Assignments section
......................................................................................... 6
Changed footnote in Absolute Maximum Ratings
............................................................................... 12
Changed Thermal Information footnotes
......................................................................................... 12
Changed Design Guidelines to Application Information and updated
........................................................ 75
Deleted ESD note, included in Device and Documentation Support section
................................................ 76
Added Magnetics section
.......................................................................................................... 78
Added Detailed Design Procedure section
...................................................................................... 79
Added Power Supply Recommendations section
............................................................................... 82
Added Layout section
............................................................................................................... 83



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