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74HC393 Folha de dados(PDF) 3 Page - Silicon Supplies

Nome de Peças 74HC393
Descrição Electrónicos  High Speed CMOS Logic
PDF  6 Pages
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Fabricante Electrônico  SS [Silicon Supplies]
Página de início  https://siliconsupplies.com/
Logo SS - Silicon Supplies

74HC393 Folha de dados(HTML) 3 Page - Silicon Supplies

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PARAMETER
SYMBOL
MIN
MAX
UNITS
DC Supply Voltage
VCC
2
6
V
DC Input or Output Voltage
VIN ,VOUT
0
VCC
V
Operating Temperature Range
TJ
-40
+85
°C
VCC = 2.0V
0
1000
VCC = 4.5V
0
500
Input Rise or Fall Times
tr, tf
VCC = 6V
0
400
ns
Recommended Operating Conditions3 (Voltages referenced to GND)
Absolute Maximum Ratings1
PARAMETER
SYMBOL
VALUE
UNIT
DC Supply Voltage (Referenced to GND)
VCC
-0.5 to +7.0
V
DC Input Voltage (Referenced to GND)
VIN
-1.5 to VCC +1.5
V
DC Output Voltage (Referenced to GND)
VOUT
-0.5 to VCC +0.5
V
DC Input Current, per pad
IIN
±20
mA
DC Output Current, per pad
IOUT
±25
mA
DC Supply Current, VCC or GND, per pad
ICC
±50
mA
Power Dissipation in Still Air
2
PD
750
mW
Storage Temperature Range
TSTG
-65 to 150
°C
3.  This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken
to avoid applications of any voltage higher than maximum rated voltages to this high-impedance circuit. For proper operation, VIN and VOUT should be
constrained to the range GND ≤ (VIN or VOUT) ≤ VCC. Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or VCC).
Unused outputs must be left open.
High Speed CMOS Logic – 74HC393
Rev 1.0
7/5/2019
LIMITS
PARAMETER
SYMBOL
VCC
CONDITIONS
25°C
85°C
FULL RANGE
4
UNITS
2V
1.5
1.5
1.5
4.5V
3.15
3.15
3.15
Minimum High-Level
Input Voltage
VIH
6.0V
VOUT = 0.1V or
VCC -0.1V
│IOUT│≤ 20µA
4.2
4.2
4.2
V
2V
0.3
0.3
0.3
4.5V
0.9
0.9
0.9
Maximum Low-Level
Input Voltage
VIL
6.0V
VOUT = 0.1V or
VCC -0.1V
│IOUT│≤ 20µA
1.2
1.2
1.2
V
 
4.  -40˚C ≤ TJ ≤ +85˚C
DC Electrical Characteristics (Voltages referenced to GND)
1.  Operation above the absolute maximum rating may cause device failure. Operation at the absolute maximum ratings, for extended periods, may
reduce device reliability. 2. Measured in plastic DIP package, results in die form are dependent on die attach and assembly method.



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